Improve your repairs with the 2UUL BH11 Magnetic Reballing Platform, an essential tool for maintenance and motherboard repair technicians. Specifically designed for solder placement on mobile phone boards, this magnetic platform offers a precise and reliable solution for reballing and BGA soldering tasks. With its strong magnetic adhesion and specialized design, it ensures exact alignment and efficient handling of electronic components.
Features:
Universal Design: Compatible with a wide range of mobile phone and drone motherboards, suitable for reballing and BGA soldering work.
Strong Magnetic Positioning: Equipped with powerful built-in magnetic adhesion that guarantees automatic and precise placement of the board’s middle frame.
High Precision and Exact Alignment: The template and base design allow precise adjustment, facilitating easy application of solder paste and placement of solder balls.
Uniform Soldering: The template design prevents solder bulging, ensuring the solder balls are complete and uniform, which extends the equipment’s lifespan.
High-Temperature Resistance: Made with high-quality materials that withstand the high temperatures typical of soldering processes.
Benefits:
Enhanced Efficiency: The strong magnetic force keeps the board securely in place during reballing, reducing the need for manual adjustments and ensuring more efficient work.
Extended Durability: The platform is designed to resist wear and deformation, guaranteeing a long service life.
Superior Quality: Made with premium materials, the platform provides reliable and consistent performance with every use.
Specifications:
Type: Magnetic Reballing Platform
Applications: Motherboard repair, BGA solder placement
Resistance: High temperature resistance
Package Contents:
1x 2UUL BH11 Magnetic Reballing Platform
The 2UUL BH11 Magnetic Reballing Platform is the perfect choice for technicians seeking precision, durability, and efficiency in their repair tasks. Get yours today and take your repairs to the next level with the best-in-class tool.
